Hynix HMT351S6CFR8C-PB Datasheet Page 11
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Rev. 1.0/Sep. 2012 11
Absolute Maximum Ratings
Absolute Maximum DC Ratings
Notes:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rat
-
ing conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement
conditions, please refer to JESD51-2 standard.
3. VDD and VDDQ must be within 300mV of each other at all times; and VREF must not be greater than
0.6XVDDQ,When VDD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV.
DRAM Component Operating Temperature Range
Notes:
1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For mea-
surement conditions, please refer to the JEDEC document JESD51-2.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. Dur-
ing operation, the DRAM case temperature must be maintained between 0 - 85
o
C under all operating conditions.
3. Some applications require operation of the DRAM in the Extended Temperature Range between 85
o
C and 95
o
C
case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply:
a. Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µs. It
is also possible to specify a component with 1X refresh (tREFI to 7.8µs) in the Extended Temperature Range.
Please refer to the DIMM SPD for option availability
b. If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use
the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b)
or enable the optional Auto Self-Refresh mode (MR2 A6 = 1b and MR2 A7 = 0b). DDR3 SDRAMs support Auto
Self-Refresh and Extended Temperature Range and please refer to component datasheet and/or the DIMM
SPD for tREFI requirements in the Extended Temperature Range.
Absolute Maximum DC Ratings
Symbol Parameter Rating Units Notes
VDD
Voltage on VDD pin relative to Vss
- 0.4 V ~ 1.8 V V 1,3
VDDQ
Voltage on VDDQ pin relative to Vss
- 0.4 V ~ 1.8 V V 1,3
V
IN
, V
OUT
Voltage on any pin relative to Vss
- 0.4 V ~ 1.8 V V 1
T
STG
Storage Temperature
-55 to +100
o
C1, 2
Temperature Range
Symbol Parameter Rating Units Notes
T
OPER
Normal Operating Temperature Range
0 to 85
o
C 1,2
Extended Temperature Range
85 to 95
o
C1,3
- DDR3 SDRAM 1
- Unbuffered SODIMMs 1
- Based on 2Gb C-die 1
- Revision History 2
- Ordering Information 3
- Key Parameters 4
- Speed Grade 4
- Address Table 4
- Pin Descriptions 5
- Symbol Type Polarity Function 6
- Pin Assignments 8
- Functional Block Diagram 9
- Rev. 1.0/Sep. 2012 10 10
- Absolute Maximum Ratings 11
- Rev. 1.0/Sep. 2012 12 12
- Rev. 1.0/Sep. 2012 13 13
- RefCA(DC) 13
- RefDQ(DC) 14
- Rev. 1.0/Sep. 2012 14 14
- Vref Tolerances 15
- Rev. 1.0/Sep. 2012 17 17
- Rev. 1.0/Sep. 2012 18 18
- Rev. 1.0/Sep. 2012 19 19
- Rev. 1.0/Sep. 2012 20 20
- Description 21
- Measured 21
- Single Ended Output Slew Rate 23
- Differential Output Slew Rate 24
- Rev. 1.0/Sep. 2012 25 25
- Rev. 1.0/Sep. 2012 26 26
- Rev. 1.0/Sep. 2012 27 27
- Rev. 1.0/Sep. 2012 28 28
- Standard Speed Bins 29
- DDR3-1066 Speed Bins 30
- DDR3-1333 Speed Bins 31
- DDR3-1600 Speed Bins 32
- Speed Bin Table Notes 33
- Rev. 1.0/Sep. 2012 34 34
- ILAC(max) 34
- IHAC(max) 34
- Rev. 1.0/Sep. 2012 35 35
- Rev. 1.0/Sep. 2012 36 36
- Rev. 1.0/Sep. 2012 37 37
- Rev. 1.0/Sep. 2012 38 38
- Rev. 1.0/Sep. 2012 39 39
- Rev. 1.0/Sep. 2012 40 40
- Rev. 1.0/Sep. 2012 41 41
- Rev. 1.0/Sep. 2012 42 42
- Rev. 1.0/Sep. 2012 43 43
- Rev. 1.0/Sep. 2012 44 44
- Rev. 1.0/Sep. 2012 46 46
- Module Dimensions 47
- 512Mx64 - HMT351S6CFR8C 48
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